l Hot runner system eliminates runner resin and improve productivity.
l Air over oil cylinder gives larger clamp force for bigger part.
l Separate high volume melting tank.
l 7 "in touch screen operator interface with multi-language PLC.
l Four post die set for larger parts.
l Equipped with light curtain and dual palm buttons for operator safety.
l Ejection system is equipped.
Application
Our machines are engineered for low pressure molding applications. Using specialty resins to encapsulate delicate parts.
Applications including : automotive electronics, PCBA，coil, fiber-optic, LED lighting, wire, cable, etc.
Specification
Machine Size / Weight | 2205 mm x 2240 mm x 3050 mm |
Footprint | 2205 mm x 2240 mm |
Working Station Height | 1070 mm |
Melting Tank Model & Q'ty 1 | LPMS 500B-30升x 3 |
Auto Feeding System | Optional |
Gun Model & Tip | LPMS-HR1 |
Each Station Gun Tip Qty | 8，depends on part design |
Heated Hose Model & Q'ty 2 | LPMS-H16J x 1 |
Electricity 3 | 200-240VAC/1 Phase/ 50Hz |
Temperature Control Zones | 18 according to the part |
Temperature Range 4 | Ambient up to 446°F |
Max .Power | 25 Kw |
Min. Air Pressure | 0.5MPa | 73 Psi |
Air Consumption | 0.1 m3/min | 3.5 ft3/min |
Clamping Force | Max.150 Tons |
Clamping Stroke | 150 mm | 5.9 in |
Control System | PLC+7 in HMI |
Safety Protection | Light Curtain |
Max . Part Size | 600 mm x 600 mm x 30 mm 23.62 in x 23.62 in x 1.18 in |
Dimension
Machine dimension
Mold set dimension
Video
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